| Código HS | 204726 |
| Contenido De Va | 28% |
| Índice De Fusión | 150 g /10 min |
| Densidad | 0,945 g /cm³ |
| Punto De Fusión | 72 ° C |
| Temperatura De Ablandamiento Vicat | 55 ° C |
| Temperatura De Transición Vítrea | -35 °C |
| Resistencia A La Tracción | 11 MPa |
| Alargamiento De Rotura | 800% |
| Dureza | 78 Orilla A |
| Temperatura Frágil | -60 °C |
Como fábrica acreditada Elevate EM283 EVA Copolímero Resina, 28% VA, 150 MI, Caliente Derretir Adhesivo Grado, hacemos cumplir estrictos protocolos de calidad: cada lote se somete a rigurosas pruebas para garantizar estándares de eficacia y seguridad consistentes.
| Embalaje | Elevate EM283 EVA Copolymer Resina, 28% VA, 150 MI, grado adhesivo de fusión en caliente, suministrado en bolsas de 25 kg. |
| Carga De Contenedores (20 'FCL) | 20 'FCL: bolsas de 25 kg en paletas, envueltas en plástico retráctil y aseguradas; aproximadamente 10 MT por contenedor, aptas para adhesivo termofusible. |
| Envío | Elevate EM283 EVA Copolymer Resin se envía como pellets sólidos no peligrosos en bolsas de papel de múltiples paredes o sacos de 25 kg, paletizados y envueltos elásticos. Almacene en un área fresca y seca lejos de la luz solar directa, fuentes de calor y humedad para evitar que se apelmace o se degrada. Garantice un manejo adecuado para mantener la integridad del producto durante el tránsito y el almacenamiento. |
| Almacenamiento | Guarde Elevate EM283 en un área fresca, seca y bien ventilada lejos de la luz solar directa, el calor y las fuentes de ignición. Mantenga los contenedores originales herméticamente sellados para evitar la absorción de humedad y la contaminación. Evite la exposición prolongada a altas temperaturas, que puede hacer que los pellets se bloqueen o se fusionen. Siga las pautas de vida útil del fabricante y gire el stock según sea necesario. |
| Duración | La vida útil es de 2 años a partir de la fecha de fabricación cuando se almacena sin abrir, fresco y seco, lejos de la luz solar directa. |
Elevate EM283 is metered into carton-sealing hot melt systems as the base polymer at 30–40 wt% of the total charge, with the balance split between a rosin ester or C5/C9 hydrocarbon tackifier at 25–35 wt%, a Fischer-Tropsch or paraffin wax at 20–30 wt%, and a hindered phenol/phosphite antioxidant at 0.3–1.0 wt%. The resin’s vinyl acetate content of 28% and melt mass-flow rate of 150 g/10 min under ISO 1133-1:2022, 190°C/2.16 kg, translate to a low melt viscosity at the 160–170°C application window used on high-speed case erectors. Compliance for indirect food contact is governed by FDA 21 CFR 175.105 when the adhesive remains behind the functional barrier of the corrugated board; European placing on the market of the finished packaging is assessed under Regulation (EC) No 1935/2004 Article 3 and good manufacturing practice under Regulation (EC) No 2023/2006. Hot melt viscosity is verified by ASTM D3236-15, and ring-and-ball softening point by ASTM E28-18. In a typical slot-nozzle or bead applicator line running at 60–90 m/min, set times of 0.5–2.0 s are achieved when the board surface temperature is 15–35°C; the low melt viscosity of EM283 promotes wetting of mineral-coated linerboard but can increase penetration into lightweight kraft substrates if the adhesive is applied above 175°C. Field experience on high-speed lines indicates that char accumulation in heated-hose dead zones becomes measurable after 6–8 h at melt temperatures above 190°C, requiring continuous circulation of the melt and avoidance of stagnant manifold sections. Finished stock for this segment includes regular slotted container cases, die-cut trays, multipack sleeves, e-commerce shipping boxes, and freezer-grade corrugated secondary packaging, where the 28% VA comonomer content contributes to cold-flex response; cold-shipping validation is performed on the finished case under the distributor’s specified temperature cycle because published data for EM283 in frozen sealing configurations is limited.
Perfect binding lines operating above 12,000 cycles per hour use EM283-containing hot melts held in pre-melt tanks at 160–180°C and delivered by gear pumps to spine roller and side glue applicators after spine milling and notching of folded signatures. The resin is incorporated at 32–40 wt% of the formulation, paired with a rosin ester or hydrocarbon tackifier at 30–38 wt%, a wax fraction of 8–18 wt% selected to balance open time and block resistance, and an antioxidant at 0.3–0.7 wt%; polymeric additives such as microcrystalline wax or low-molecular-weight polyethylene may be compounded at 0–5 wt% to adjust cold crack and adhesion to coated text stocks. Compliance for this segment is process driven: peel strength on book blocks is tested by ASTM D1876-15 T-peel, while application temperature and melt stability are monitored under ASTM D3236-15 and ISO 1133-1:2022; where library or institutional supply is involved, durability expectations align with ANSI/NISO Z39.78-2000 or successor purchasing-authority protocols, and children’s books may trigger accessible-component limits under CPSIA Section 101 and Section 108. The process sequence requires the milled spine to receive a penetrating primer coat followed by a cover adhesive layer; side glue is applied simultaneously, and the cover is clamped at 0.2–0.5 MPa for 5–10 s before the book enters a cooling conveyor with surface temperatures of 20–30°C. Open time for EM283-based bookbinding formulations is typically held between 5 s and 10 s at 170°C; if the line stops, adhesive in the pot can degrade and produce gel particles that block the spine roller doctor gap. Finished product types include perfect-bound paperback books, trade catalogs, annual reports, directories, and multipage brochures where high page-pull values after 0–4°C cold conditioning are specified.
Edge banding of MDF and particleboard panels with PVC, ABS, melamine, or veneer strips places a different demand on EM283: the melt must fill a 0.1–0.3 mm gap between the panel edge and the banding strip while resisting sag on vertical profiles after the pressure rollers release. The resin is formulated at 35–45 wt% with a hydrogenated hydrocarbon tackifier at 20–30 wt%, calcium carbonate or barium sulfate filler at 5–15 wt% to control shrink and gap-filling, paraffin wax at 5–15 wt%, and antioxidant at 0.3–0.8 wt%. Filler loadings above 20 wt% are known on production lines to accelerate abrasive wear of gear pumps and doctor rollers; loadings below 5 wt% may increase adhesive shrinkage and create visible witness lines on high-gloss PVC banding. The adhesive is applied by a heated roller or slot nozzle at 170–190°C; panel feed speeds are typically 10–30 m/min, and pressure rolls operate at 0.2–0.4 MPa with a contact time of 0.5–1.5 s. Compliance for interior non-structural wood assembly is anchored to EN 204:2016 duty classes D2 and D3, while the composite wood substrate remains governed by CARB ATCM 93120 and TSCA Title VI, 40 CFR Part 770 for formaldehyde emissions; the adhesive formulation itself must satisfy REACH Regulation (EC) No 1907/2006 Annex XVII restrictions. On high-speed edge banding machines, the low melt viscosity contributed by the 150 MI resin reduces stringing during roller transfer, but if the melt temperature reaches 210°C and remains there for more than 6 h, char formation at heater surfaces becomes a batch-to-batch consistency problem, causing nozzle plugging and black speck contamination on white or light-coloured banding. This adhesive class is not qualified under EN 205:2016 structural bond or D4 full exterior duty. Finished products include kitchen cabinet doors, office desktops, wardrobe doors, retail shelving edges, and acoustic panel perimeter banding.
In nonwoven disposable lamination, EM283 is fiberized through spiral spray or meltblown pattern nozzles at 140–160°C and combined with a tackifier-dominant formulation to produce sprayable adhesives with add-on weights of 1–3 g/m² on polyethylene film or nonwoven backsheets. The compounding window differs from packaging and bookbinding: EM283 is added at 25–35 wt%, a lower-viscosity tackifier such as a C5 hydrocarbon or hydrogenated rosin ester at 35–45 wt%, a naphthenic or paraffinic plasticizer at 10–20 wt%, and a wax fraction of 0–10 wt%, with antioxidant at 0.3–0.7 wt%. Below 25 wt% resin content, creep resistance at body temperature and cohesive strength on nonwoven substrates become insufficient for elastic attachment and core stabilization; above 40 wt% resin content, initial pressure-sensitive tack can decline because the tackifier concentration is displaced, requiring reformulation of the plasticizer rather than an increase in application temperature. Compliance pathways for this segment include ISO 10993-5:2009 cytotoxicity and ISO 10993-10:2010 sensitization when the laminate is a component of a medical device regulated under EU 2017/745 or a US FDA premarket pathway; for hygiene nonwovens that do not make medical claims, the formulation must satisfy REACH and applicable skin-contact requirements, while food-contact assessments under EC 1935/2004 apply only where the nonwoven functions as a secondary food-contact absorbent pad. Process reliability is sensitive to temperature control: spiral spray pattern breakup occurs when melt temperature swings more than ±5°C around the set point, and prolonged exposure above 175°C can produce gel particles that plug 0.2–0.5 mm nozzle orifices. Production lines run at 150–400 m/min, with nip pressure set by film tension and embossing roll pattern. Finished products include diaper waistband lamination, feminine hygiene topsheet composites, adult incontinence core containment, and surgical gown nonwoven reinforcement where low-temperature sprayability and fast set are manufacturing requirements.
On profile wrapping lines, EM283 is compounded into a hot melt that is applied through a slot die or multi-roller station to shaped MDF, pine, or PVC profiles before decorative foil, paper, or PVC film is wrapped under pressure rollers. The formulation window is 30–38 wt% EM283, 20–28 wt% hydrocarbon tackifier, 15–25 wt% Fischer-Tropsch or high-melting paraffin wax, 10–20 wt% calcium carbonate filler, and 0.3–0.8 wt% antioxidant. The high melt index of EM283 lowers melt viscosity and improves wet-out on primed melamine and UV-lacquer surfaces, but it also reduces sag resistance on vertical edges if the application temperature is not lowered or the wax composition is not reformulated. The critical processing window in this segment is ±5°C around 160°C; below 150°C, wet-out on high-gloss PVC and melamine faces decreases, producing edge peel after thermal cycling, while above 170°C, adhesive can sag on vertical surfaces and bleed through thin PVC or lacquer films. Compliance for interior profile-wrapped components follows EN 204:2016 duty class D3 for occasional water contact; this adhesive class is not intended to meet EN 205:2016 structural bond requirements or D4 full exterior duty. The production sequence begins with infrared preheating of the substrate to 30–50°C, followed by adhesive application at 150–170°C, foil wrapping through pressure rollers at 10–50 m/min, and ambient cooling on a run-out conveyor. Melt viscosity is monitored by ASTM D3236-15 and softening point by ASTM E28-18; char accumulation in slot-die manifolds at temperatures above 180°C has been observed to cause intermittent adhesive splitting on high-speed wrap stations. Finished products include MDF profile-wrapped door frames, picture frame stock, window sill covers, furniture trim, and cable trunking profiles.
For mattress and upholstered furniture foam lamination, EM283 is used as the base polymer in hot melts applied to open-cell polyurethane foam, nonwoven backing, or fabric layers. Formulation ratios are typically 35–50 wt% EM283, 25–35 wt% tackifier, 5–15 wt% wax, and 0.3–0.7 wt% antioxidant; the polymer-rich side of the formulation window is used where bond line flexibility after compression set is critical. The 150 MI resin contributes a low melt viscosity that permits roll coater or spray application at 150–170°C, but open-cell foam is prone to strike-through when adhesive viscosity is too low or when application temperature exceeds 170°C. Process engineers therefore run open-time tests on the actual substrate stack; typical open times are 10–30 s at 20°C board temperature, with compression lamination at 0.05–0.2 MPa for 5–20 s. Compliance is dominated by the finished assembly rather than the adhesive alone: in the United States, upholstered furniture must satisfy California Technical Bulletin 117-2013 for smoldering ignition, and mattresses are tested under 16 CFR Part 1633 for total heat release; the adhesive layer must not contribute to flame propagation or melting drip. REACH Regulation (EC) No 1907/2006 Annex XVII restricts certain substances in articles; no chlorinated paraffins or amine-based additives are introduced in EM283 formulations for this segment because these can interfere with polymer stability or generate odor after lamination. Finished product types include memory foam mattress layer bonding, upholstered furniture foam-to-fabric lamination, mattress border assembly, and automotive seat cushion lamination in applications where a flexible, non-structural thermoplastic bond line is acceptable. Published data for long-term creep of EM283 in high-density viscoelastic foam stacks is limited, so field validation is required for consumer mattress warranty cycles.
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Elevate EM283 EVA Copolymer Resin is designated as a Hot Melt Adhesive Grade with a vinyl acetate comonomer content of 28% by mass and a nominal melt flow rate of 150 g/10 min measured under ISO 1133-1:2022 and ASTM D1238 at 190 °C with 2.16 kg load. The vinyl acetate content is classed according to ASTM D5594. This combination of high VA content and high melt index places the resin in the low-viscosity, soft-segment-rich segment of EVA hot-melt base polymers. The product is supplied for compounding into solvent-free thermoplastic adhesive systems rather than as a finished adhesive. Final compliance with food-contact regulations such as FDA 21 CFR 175.105, and with chemical inventory requirements under REACH and RoHS, depends on the complete formulation, conversion conditions, and end-use exposure.
| Parameter | Test method | Specification relevance |
|---|---|---|
| Vinyl acetate content | ASTM D5594 | 28% by mass |
| Melt flow rate | ISO 1133-1:2022 /ASTM D1238 | 150 g/10 min at 190 °C, 2.16 kg |
| Grade designation | — | Hot Melt Adhesive Grade |
The 28% VA content modifies the crystal structure of the ethylene segments. The acetate pendant groups disrupt chain packing, reduce crystallinity, and lower the crystalline melting range relative to EVA copolymers with 18% to 22% VA at equivalent melt index. The practical result is a resin that forms softer, more flexible adhesive films with improved wetting of polar substrates such as paperboard, coated carton stock, aluminum foil, and corona-treated polyethylene. The resin is also less prone to low-temperature brittleness than lower-VA EVA grades. However, the same structural shift reduces cohesive strength, creep resistance, and upper service temperature. These trade-offs are not defects; they define the application window of the grade.
Under differential scanning calorimetry according to ASTM D3418, a 28% VA EVA exhibits a lower enthalpy of fusion and a broader melting range than an 18% VA copolymer. The reduction in crystallinity lowers room-temperature modulus and allows the adhesive film to deform with the bonded substrate instead of concentrating stress at the interface. The acetate group also contributes polarity and hydrogen-bond acceptor character, which increases adhesion to polar surfaces compared with lower-VA EVA resins. This is important in bookbinding, carton sealing, and film labelling where adhesion must develop rapidly against coated paper and polar polymer films.
Conversely, the loss of crystallinity reduces the shear resistance of the bonded joint. Formulations based on a 28% VA EVA typically show measurable softening in static shear between 50 °C and 60 °C, depending on tackifier softening point, wax loading, and wax type. The resin is therefore selected for low-temperature flexibility, fast set, and polar adhesion rather than for elevated-temperature load-bearing joints. The balance between adhesion and cohesion must be managed through formulation. Higher tackifier levels can raise adhesion, but excessive tackifier may reduce heat resistance further if the tackifier is low-molecular-weight or low-softening-point.
In hot-melt compounding, the 150 g/10 min melt index permits lower melt viscosity and faster wet-out than lower-flow EVA grades. A 28% VA, 43 MI counterpart would require more shear energy and higher melt temperature to achieve the same penetration into porous substrates. The low viscosity of EM283 allows a formulator to maintain a target application viscosity while increasing polymer loading, which can partially recover cohesive strength. The resin also helps reduce nozzle stringing and tailing on high-speed packaging lines because the molten adhesive remains low-viscosity during deposition and shear thinning is less limiting for thin bond lines.
In production-scale compounding on a corotating twin-screw extruder with a 45:1 L/D ratio, the high-MI grade reduces melt pressure and torque compared with lower-MI EVA copolymers at constant screw speed and throughput. Barrel setpoints in the range of 120–150 °C are generally sufficient for homogeneous mixing when the screw configuration provides moderate dispersive and distributive mixing. Processing above 230 °C should be avoided because thermal deacetylation of vinyl acetate accelerates sharply, releasing acetic acid and generating conjugated polyene structures that cause yellowing. Acetic acid release can corrode unplated steel surfaces in screws, barrels, melt piping, and application equipment. Corrosion-resistant construction, such as nitrided steel or stainless steel, is advised for systems used with EVA hot-melt compounds. Hold-up time in melt reservoirs, flexible heated hoses, and application heads should be minimized because low-viscosity resin can stagnate in dead zones and degrade locally.
Molten adhesive viscosity can be characterized by ASTM D3236. Because the base resin contributes low viscosity, formulators can achieve target application viscosities of 1,000–2,500 mPa·s at 180 °C while retaining adequate polymer content. The actual viscosity depends on tackifier chemistry, oil or wax selection, and filler loading. The base resin itself is not pressure-sensitive and must be compounded with tackifier resins, waxes, and antioxidants to meet open-time, loop tack, and shear adhesion failure temperature requirements.
At fixed 28% VA content, a melt flow rate of 150 g/10 min indicates a lower weight-average molecular weight than EVA grades with 43 g/10 min or 25 g/10 min. Lower molecular weight increases the number of chain ends per unit mass and reduces the plateau modulus. The advantages are lower melt viscosity, lower pump pressure, faster flow into porous board and paper fibers, and shorter compression time on high-speed case-sealing lines. The disadvantage is reduced ultimate tensile strength and elongation at break as measured by ISO 527-2, which translates to lower cohesive strength in the final adhesive.
The low-viscosity character also affects coating behavior. In slot-die application with a 0.5 mm shim and die temperatures near 165 °C, a 150 g/10 min EVA can produce a thin continuous coating at high line speed, but edge feathering and die lip build-up must be managed through die geometry and temperature uniformity. Published data for this specific configuration is limited, so pilot trials are required to establish maximum stable line speed and coat weight uniformity. Compared with a 43 g/10 min EVA, EM283 should be selected when the process requires low melt viscosity, reduced thermal load, or deep substrate penetration. It should not be specified when the bond must resist sustained shear at elevated temperature or when the joint must fill wide gaps without reinforcement.
Relative to amorphous poly-alpha-olefins and metallocene polyolefins used in hot-melt adhesives, EM283 provides higher polar adhesion to cellulosic and coated substrates and a well-defined EVA thermal profile. It has lower resistance to prolonged high-temperature aging than some metallocene grades and lower upper service temperature than polyamide hot-melt adhesives. The product is therefore a packaging and bookbinding base resin where polar adhesion, fast set, and low application temperature are primary process demands.
Typical application areas include carton and case sealing, bookbinding, side-seam bonding, label stock assembly, textile lamination, profile wrapping, and general product assembly. In bookbinding, the 28% VA grade provides adhesion to coated paper and cloth while retaining low-temperature flexibility during cold storage and distribution. In packaging, the low melt viscosity enables high-speed roll coating, extrusion coating, or nozzle application with reduced thermal degradation because formulation and application temperatures can be lower than those required for lower-MI, lower-VA systems. The resin is not suitable for structural bonding or for continuous service above approximately 60 °C without crosslinking or reinforcement. Moisture uptake of neat pellets is generally low, but surface condensation should be avoided. If pellets are transferred from cold storage to a warm, humid environment, pre-drying at 50–60 °C for 2–4 h in a desiccant dryer is typically sufficient before melt processing.
